公开(公告)号：US20250076775A1

公开(公告)日：2025-03-06

申请号：US18599673

申请日：2024-03-08

Applicant: SAMSUNG ELECTRONICS CO,. LTD.

Inventor： CHULMIN CHO ,  YOUNGDUK SUH ,  KYOUNGWHAN OH ,  SANGHYUN LIM ,  YOUNGHYUN IM ,  JAEHONG LIM ,  DOHYUN JUNG ,  SEOK HEO ,  YOUNGHO HWANG

IPC: G03F7/00

Abstract: A substrate processing method, comprising: using an exposure apparatus to process a substrate; and cleaning an extreme ultraviolet (EUV) source of the exposure apparatus, wherein cleaning an extreme ultraviolet (EUV) source comprising: spraying a cleaning solution on an inner surface of a housing of an EUV source; cleaning the inner surface of the housing; and aspirating a material produced from the cleaning of the inner surface of the housing, wherein the housing includes an internal space defined by the inner surface of the housing, wherein the internal space becoming narrower in a first direction, and wherein the cleaning solution includes sodium hydroxide (NaOH).

公开(公告)号：US20200260534A1

公开(公告)日：2020-08-13

申请号：US16656054

申请日：2019-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGHO HWANG ,  Chulmin Cho ,  Seok Heo

IPC: H05B6/06 ,  H01L21/67 ,  H05B1/02 ,  H05B6/44 ,  H05B6/04

Abstract: A heating module including: a plate including heating regions; heater coils disposed in the heating regions; a power source supplying an electric power to the heater coils; a switching circuit connected to the heater coils and the power source to control the electric power; temperature sensors disposed in the heating regions to sense temperatures of the heating regions; current sensors connected to the switching circuit and the heater coils to sense currents supplied to the heater coils; and a heating controller connected to the temperature sensors and the current sensors to measure temperatures of the heating regions. The heating controller is configured to detect the currents supplied to the heater coils and provides a maximum power to the heater coils regardless of a resistance difference of the heater coils, when a measured temperature is less than a predetermined temperature.

公开(公告)号：US20180164171A1

公开(公告)日：2018-06-14

申请号：US15838583

申请日：2017-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGHO HWANG ,  JANGHWAN KIM

IPC: G01L5/00 ,  H01L23/00

CPC classification number: G01L5/0076 ,  G01L5/0038 ,  H01L24/64 ,  H01L24/741 ,  H01L24/75 ,  H01L2021/603 ,  H01L2224/75824 ,  H01L2224/75841 ,  H01L2224/7592 ,  H01L2224/7598 ,  H01L2224/7692

Abstract: Provided is a method of correcting an estimated force of a bonding apparatus including measuring a first pressure of a first space in a chamber of a bonding apparatus and a second pressure of a second space in the chamber in a first state. In the first state a pressuring member is at rest within the chamber. The pressuring member is moveable within the chamber. The method includes obtaining a first estimated force. The first estimated force is an estimated force of the pressuring member in the first state, using the measured first and second pressures. The method includes obtaining a first error. The first error is a difference between a first real force and the first estimated force. The first real force is a real force of the pressuring member in the first state. The method includes correcting the first estimated force using the first error.