公开(公告)号：US20210125955A1

公开(公告)日：2021-04-29

申请号：US16992895

申请日：2020-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JIHWAN SUH ,  UN-BYOUNG KANG ,  TAEHUN KIM ,  HYUEKJAE LEE ,  JIHWAN HWANG ,  SANG CHEON PARK

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on a top surface of the first semiconductor chip. The first semiconductor chip includes a conductive pattern disposed on the top surface of the first semiconductor chip and a first protective layer covering the top surface of the first semiconductor chip and at least partially surrounds the conductive pattern. The second semiconductor chip includes a first pad that contacts a first through electrode on a bottom surface of the second semiconductor chip. A second protective layer surrounds the first pad and covers the bottom surface of the second semiconductor chip. A third protection layer fills a first recess defined in the second protective layer to face the inside of the second protective layer. The first protective layer and the third protective layer contact each other.