公开(公告)号：US20170109460A1

公开(公告)日：2017-04-20

申请号：US15277480

申请日：2016-09-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG-HWAN JANG ,  SUNGCHUL KIM ,  JISEONG DOH ,  WONSOK LEE

IPC: G06F17/50

CPC classification number: G06F17/5009 ,  G06F17/5081

Abstract: A semiconductor process simulation method includes classifying a semiconductor process simulation into a plurality of blocks based on an annealing simulation, performing a shape simulation corresponding to a block selected from the plurality of blocks, and performing at least two ion implantation simulations among a plurality of ion implantation simulations corresponding to the selected block in parallel, based on result data of the shape simulation corresponding to the selected block.

公开(公告)号：US20240142960A1

公开(公告)日：2024-05-02

申请号：US18453808

申请日：2023-08-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SONGYI HAN ,  JISEONG DOH ,  JINWOO PARK ,  YERO LEE ,  HYEONKYEONG LEE ,  JAEHOON JEONG

IPC: G05B19/418

CPC classification number: G05B19/41875 ,  G05B2219/32193 ,  G05B2219/32368

Abstract: A method for determining suitability of a target receipe set for manufacturing a semiconductor device includes: obtaining a reference recipe set by searching a database based on the target recipe set, the reference recipe set has a similarity with a threshold to the target recipe set; performing deep learning based on the database, the target recipe set and the reference recipe set to predict a probability of defect occurring in the semiconductor device when manufactured using a manufacturing process based on the target recipe set; generating a target script set corresponding to the target recipe set by comparing the target recipe set with the reference recipe set; simulating the manufacturing process of the semiconductor device using the target script set; and determining the suitability of the target recipe set based on the probability of the defect and a result of the simulating of the manufacturing process.