公开(公告)号：US20170287748A1

公开(公告)日：2017-10-05

申请号：US15624066

申请日：2017-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YISUNG HWANG ,  JUNGCHUL LEE ,  JAEHONG KIM ,  TAEGYEONG CHUNG

IPC: H01L21/67

CPC classification number: H01L21/67144 ,  H01L2924/0002 ,  Y10T156/1744 ,  Y10T156/1746 ,  Y10T156/1761 ,  Y10T156/1776 ,  H01L2924/00

Abstract: An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.