公开(公告)号：US20250079232A1

公开(公告)日：2025-03-06

申请号：US18596869

申请日：2024-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： TAEJAE PARK ,  YONGKWAN LEE ,  SUNCHUL KIM ,  JUNGSOO JEON

IPC: H01L21/687 ,  H01L21/48 ,  H01L21/67 ,  H01L21/683

Abstract: A semiconductor package bonding tool includes a bonding plate and bonding blocks disposed on a bottom surface of the bonding plate. The bonding plate include first vacuum holes that vertically penetrate the bonding plate. The first vacuum holes connect a top surface of the bonding plate to the bottom surface of the bonding plate. Each of the bonding blocks includes a bonding stage disposed below a respective first vacuum hole of the first vacuum holes. The bonding stage includes a trench hole upwardly recessed from a bottom surface of the bonding stage, and a connection hole connecting a top surface of the bonding stage to the trench hole. A length in a horizontal direction of the trench hole is greater than that of the connection hole.