公开(公告)号：US11832382B2

公开(公告)日：2023-11-28

申请号：US17518982

申请日：2021-11-04

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jae Beom Byun

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K5/02

CPC分类号： H05K1/0212 ,  H05K5/0213 ,  H05K5/0247 ,  H05K2201/10159

摘要： A printed circuit board (PCB) including: a negative thermal coefficient (NTC) thermistor which provides an electrical signal received from outside the PCB, wherein an electrical resistance of the NTC thermistor varies according to a negative thermal coefficient; and a heating pattern which receives the electrical signal from the NTC thermistor, wherein the heating pattern includes a positive thermal coefficient (PTC) thermistor with an electrical resistance that varies according to a positive thermal coefficient, wherein the PTC thermistor has a first thermal coefficient of resistance at a first critical temperature or below and changes to a second thermal coefficient of resistance above the first critical temperature, and the NTC thermistor has a third thermal coefficient of resistance at a second critical temperature or below and changes to a fourth thermal coefficient of resistance above the second critical temperature.