MODULE SUBSTRATE FOR SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE AND TEST SOCKET FOR TESTING THE SAME

    公开(公告)号:US20230213554A1

    公开(公告)日:2023-07-06

    申请号:US17884661

    申请日:2022-08-10

    CPC classification number: G01R1/0466 G01R1/0483 G01R31/2863 G01R31/2884

    Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.

    ELECTRONIC DEVICE, GENERATION METHOD FOR SOFTWARE CODE AND ANALYZATION METHOD FOR TEST COVERAGE

    公开(公告)号:US20240330158A1

    公开(公告)日:2024-10-03

    申请号:US18537632

    申请日:2023-12-12

    CPC classification number: G06F11/3676 G06F11/3688

    Abstract: An electronic device includes: a memory in which software code, including a plurality of test positions is loaded; and a processor configured to execute the software code in order according to a control flow, wherein the processor is configured to allocate a test coverage data region in the memory, execute the software code based on a test scenario, when an execution position reaches a target test position among the plurality of test positions, mark a memory position corresponding to the target test position in the test coverage data region in response to a test coverage marking instruction associated with the target test position, and output test coverage data of the test coverage data region in response to an external command.

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