公开(公告)号：US20230213554A1

公开(公告)日：2023-07-06

申请号：US17884661

申请日：2022-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangkyu BANG ,  Kiljoong YUN ,  Yun CHANG ,  Jaegyu CHOI

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R1/0466 ,  G01R1/0483 ,  G01R31/2863 ,  G01R31/2884

Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.

公开(公告)号：US20230098635A1

公开(公告)日：2023-03-30

申请号：US17738272

申请日：2022-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kiljoong YUN ,  Kwangkyu Bang ,  Yun Chang ,  Jaegyu Choi

IPC: G01R31/28 ,  G01R1/04

Abstract: A test socket includes: a first body including a fixing portion configured to receive a sample having a plurality of test terminals; a second body facing the first body and coupled with the first body such that the second body rotates relative to the first body about a hinge pin; a test board provided on the second body and configured to test the sample, wherein the test board has a plurality of first openings provided therein; and a plurality of interface pins penetrating through the first openings, wherein each of the plurality of interface pins includes a contact pin and a spring, wherein the contact pin is provided in a first end portion of each of the plurality of interface pin and is configured to come into contact with a test terminal of the plurality of test terminals, and the spring elastically supports the contact pin.