公开(公告)号：US20230284378A1

公开(公告)日：2023-09-07

申请号：US18103175

申请日：2023-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun-Ki YUN ,  Hwi-Jong Yoo ,  Jeonggi Yoon

IPC: H05K1/02 ,  H05K1/16 ,  G06F3/06 ,  G06F13/10

CPC classification number: H05K1/0286 ,  H05K1/0296 ,  H05K1/167 ,  G06F3/0679 ,  G06F13/10 ,  H05K2201/10159 ,  H05K2201/10659 ,  G06F2213/0026

Abstract: A storage device includes a printed circuit board including a controller site, a first memory site, a second memory site, first conductive lines connected with the controller site, second conductive lines connected with the first memory site, and third conductive lines connected with the second memory site, a controller package provided on the controller site, a first nonvolatile memory package provided on the first memory site, a second nonvolatile memory package provided on the second memory site, and at least one resistor connecting at least one conductive line of the first conductive lines with at least one conductive line of the second conductive lines.