公开(公告)号：US20180033890A1

公开(公告)日：2018-02-01

申请号：US15728965

申请日：2017-10-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-hee Park ,  Young-Seok Song ,  Ji-Soo Chang ,  Young-Chul Hwang

IPC: H01L29/78 ,  H01L27/088 ,  H01L29/66 ,  H01L27/092 ,  H01L21/8234

CPC classification number: H01L29/7856 ,  H01L21/823431 ,  H01L21/823437 ,  H01L27/0886 ,  H01L27/0924 ,  H01L29/66545

Abstract: An IC device includes a substrate including a device region having a fin-type active region and a deep trench region; a gate line that extends in a direction intersecting the fin-type active region; and an inter-device isolation layer that fills the deep trench region. The gate line includes a first gate portion that extends on the device region to cover the fin-type active region and has a flat upper surface at a first level and a second gate portion that extends on the deep trench region to cover the inter-device isolation layer while being integrally connected to the first gate portion and has an upper surface at a second level that is closer to the substrate than the first level.

公开(公告)号：US12045329B2

公开(公告)日：2024-07-23

申请号：US17229256

申请日：2021-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gi Jin Kang ,  Sung Ung Kwak ,  Ji-Soo Chang

IPC: G06F21/32 ,  G06F21/60

CPC classification number: G06F21/32 ,  G06F21/602

Abstract: A smart card is provided. The smart card includes a peripheral circuit configured to control a fingerprint sensing array and generate a raw image, an authentication information processing module configured to process the raw image into fingerprint information for verification, a security module configured to determine whether the fingerprint information for verification matches registered fingerprint information to determine usage approval or disapproval for a payment request, and an active shield overlapping the security module. The peripheral circuit, the authentication information processing module, and the security module are integrated into one chip.

公开(公告)号：US09899913B2

公开(公告)日：2018-02-20

申请号：US14514768

申请日：2014-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Soo Chang

IPC: H02M3/156

CPC classification number: H02M3/156 ,  H02M2003/1566

Abstract: A dual-mode switching D.C.-to-D.C. converter includes a power conversion unit and a switch driver. The power conversion unit generates a D.C. output voltage based on a switch driving signal and a D.C. input voltage. The switch driver performs frequency compensation on the D.C. output voltage to generate a feedback voltage, and compares the feedback voltage with a comparison input signal to generate a pulse-width-modulated signal. The switch driver compares the D.C. output voltage with a first reference voltage to generate a comparison output signal. The switch driver generates the switch driving signal based on the pulse-width-modulated signal in a normal operation mode, and generates the switch driving signal based on the comparison output signal in an abnormal operation mode. The normal operation mode and the abnormal operation mode are based on a load current flowing through a load connected to the switching D.C.-to-D.C. converter.