公开(公告)号：US10361351B2

公开(公告)日：2019-07-23

申请号：US15922578

申请日：2018-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Hoon Kwak ,  Sung Jin Ahn ,  Hak Hwan Kim ,  Jin Hwan Kim ,  Jin Kweon Chung ,  Min Jung Kim

IPC: H01L33/62 ,  H01L33/50 ,  H01L23/488 ,  H01L23/29 ,  H01L33/36

Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.