公开(公告)号：US20200211918A1

公开(公告)日：2020-07-02

申请号：US16811944

申请日：2020-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Ho CHUNG ,  Soo Ho NOH ,  Jin Seok yoon PARK ,  Se Young JANG

IPC: H01L23/367 ,  C09K5/14 ,  G06F1/20 ,  H05K9/00 ,  H05K7/20 ,  H05K1/02 ,  H01L23/373

Abstract: An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.