公开(公告)号：US20210240302A1

公开(公告)日：2021-08-05

申请号：US16984685

申请日：2020-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongsuk KIM ,  Dongkyun Kim ,  Seogwoo Hong ,  Jinmyoung Kim ,  Jinhee Nam

IPC: G06F3/044 ,  G06F3/041 ,  G06K9/00

Abstract: A touch sensor may include: a touch panel including a plurality of electrodes and a plurality of electrode pads respectively connected to the plurality of electrodes; a bonding layer disposed on and in contact with the plurality of electrode pads; and a printed circuit board including: an insulating layer including a first surface adjacent to the bonding layer and a second surface facing the first surface; a plurality of first bonding pads provided in a first region of the first surface of the insulating layer; a plurality of second bonding pads disposed on the second surface of the insulating layer; and a plurality of extension pads disposed on a second region different from the first region of the first surface of the insulating layer and respectively connected to the plurality of second bonding pads.

公开(公告)号：US11237680B2

公开(公告)日：2022-02-01

申请号：US16984685

申请日：2020-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongsuk Kim ,  Dongkyun Kim ,  Seogwoo Hong ,  Jinmyoung Kim ,  Jinhee Nam

IPC: G06F3/044 ,  G06K9/00 ,  G06F3/041

Abstract: A touch sensor may include: a touch panel including a plurality of electrodes and a plurality of electrode pads respectively connected to the plurality of electrodes; a bonding layer disposed on and in contact with the plurality of electrode pads; and a printed circuit board including: an insulating layer including a first surface adjacent to the bonding layer and a second surface facing the first surface; a plurality of first bonding pads provided in a first region of the first surface of the insulating layer; a plurality of second bonding pads disposed on the second surface of the insulating layer; and a plurality of extension pads disposed on a second region different from the first region of the first surface of the insulating layer and respectively connected to the plurality of second bonding pads.