-
公开(公告)号：US20230402439A1
公开(公告)日：2023-12-14
申请号：US17985332
申请日：2022-11-11
申请人： SAMSUNG ELECTRONICS CO., LTD. , CHUNGBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
发明人： Kyungwook Hwang , Jaewook Jeong , Junsik Hwang , Dongkyun Kim , Dongho Kim , Hyunjoon Kim , Joonyong Park , Seogwoo Hong , Sanghoon Song , Minchul Yu
CPC分类号： H01L25/167 , H01L33/38 , H01L24/05 , H01L24/95 , H01L2224/05559 , H01L24/16 , H01L2224/16145 , H01L2224/95001
摘要： Provided is a microchip including a chip body having a first surface and a second surface facing the first surface, and an electrode layer on the second surface, wherein a surface roughness of the first surface is smaller than a surface roughness of an upper surface of the electrode layer such that van der Waals force between the first surface and an external contact surface are greater than van der Waals force between the electrode layer and the external contact surface.
-
公开(公告)号：USD997157S1
公开(公告)日：2023-08-29
申请号：US29750379
申请日：2020-09-14
设计人： Dongkyun Kim , Namhyun Kang , Minah Koh , Mingeun Kim , Hakdo Kim , Sol Lee
摘要： FIG. 1 is a front perspective view of a tablet computer, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a rear perspective view thereof.
The broken lines illustrating portions of the tablet computer form no part of the claimed design.-
公开(公告)号：US20230141485A1
公开(公告)日：2023-05-11
申请号：US17735747
申请日：2022-05-03
发明人： Hyunjoon KIM , Dongkyun Kim , Joonyong Park , Seogwoo Hong , Kyungwook Hwang , Junsik Hwang
IPC分类号： H01L25/13 , H01L21/673
CPC分类号： H01L25/13 , H01L21/67333
摘要： A device transfer substrate includes a plurality of recesses, wherein each of the plurality of recesses includes a first region having a shape of a first figure, a second region having a shape of a second figure, and an overlapping region formed as a portion of the first region partially overlaps a portion of the second region, wherein a maximum width of the overlapping region in a direction intersecting with a straight line passing through a center of the first figure and a center of the second figure is less than a diameter or a diagonal length of the first figure and less than a diameter or a diagonal length of the second figure.
-
公开(公告)号：US11614364B2
公开(公告)日：2023-03-28
申请号：US17386144
申请日：2021-07-27
发明人： Dongkyun Kim , Hyuck Choo
摘要： A long-wave infrared detecting element includes a magnetic field generator configured to generate a magnetic field; a substrate on the magnetic field generator; a superparamagnetic material layer disposed to be separated from the substrate and magnetized by the magnetic field generated by the magnetic field generator; a support unit on the substrate to support the superparamagnetic material layer such that the superparamagnetic material layer separated from the substrate, such that the support unit and the superparamagnetic material layer generate heat by absorbing infrared radiation from the outside; and a magneto-electric conversion unit that generates an electrical signal proportional to both a strength of the magnetic field generated by the magnetic field generator and the magnetization of the superparamagnetic material layer.
-
公开(公告)号：US11604099B2
公开(公告)日：2023-03-14
申请号：US17479682
申请日：2021-09-20
发明人： Dongkyun Kim
摘要： Provided is a long-wave infrared detecting element including a magnetic field generator configured to generate a magnetic field, a substrate provided on the magnetic field generator, a magnetic-electric converter that is spaced apart from the substrate and configured to generate an electrical signal based on the magnetic field generated by the magnetic field generator, and an support unit that is provided on the substrate and supports the magnetic-electric converter in a state in which the magnetic-electric converter is spaced apart from the substrate, the support unit being configured to generate heat by absorbing incident infrared radiation, wherein the electrical signal changes corresponding to temperature changes of the magnetic-electric converter based on the incident infrared radiation directly absorbed in the magnetic-electric converter and temperature changes of the magnetic-electric converter based on the incident infrared radiation absorbed in the support unit.
-
公开(公告)号：USD978151S1
公开(公告)日：2023-02-14
申请号：US29750584
申请日：2020-09-15
设计人： Namhyun Kang , Sol Lee , Dongkyun Kim , Minah Koh , Hakdo Kim , Mingeun Kim
-
公开(公告)号：USD931824S1
公开(公告)日：2021-09-28
申请号：US29709452
申请日：2019-10-15
设计人： Hyoungshin Park , Dongkyun Kim , Yunjin Kim , Seonkeun Park , Seungho Jang
-
公开(公告)号：USD929977S1
公开(公告)日：2021-09-07
申请号：US29707409
申请日：2019-09-27
设计人： Hyoungshin Park , Dongkyun Kim , Yunjin Kim , Seonkeun Park , Seungho Jang
-
公开(公告)号：USD927471S1
公开(公告)日：2021-08-10
申请号：US29739882
申请日：2020-06-30
设计人： Hyoungshin Park , Dongkyun Kim , Yunjin Kim , Seonkeun Park , Seungho Jang
-
公开(公告)号：USD873255S1
公开(公告)日：2020-01-21
申请号：US29656842
申请日：2018-07-17
设计人： Hyoungshin Park , Seungho Jang , Dongkyun Kim , Seonkeun Park , Yunjin Kim
-
-
-
-
-
-
-
-
-
搜索结果
95 条记录 (耗时 0.022 秒)
