公开(公告)号：US20230197485A1

公开(公告)日：2023-06-22

申请号：US17890648

申请日：2022-08-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soonkyu HWANG ,  Jinyeol YANG ,  Haegu LEE ,  Jae-Min JEON ,  Jin Hee HAN

IPC: H01L21/67 ,  G06T7/00

CPC classification number: H01L21/67288 ,  G06T7/0004 ,  G06T2207/10048 ,  G06T2207/30148

Abstract: Disclosed are semiconductor inspection apparatuses, systems, and methods. The semiconductor inspection method comprises heating a top surface of a semiconductor package, capturing the top surface of the heated semiconductor package to obtain thermal image data, and analyzing the thermal image data. The analyzing the thermal image data includes analyzing first thermal image data about the top surface at a first region of the semiconductor package, and analyzing second thermal image data about the top surface at a second region of the semiconductor package. The analyzing the first thermal image data includes obtaining first region data about temperature distribution at the top surface of the first region, and using the first region data to obtain thickness data of a cover molding layer about thickness distribution of the molding layer on the chip in the first region.

公开(公告)号：US20210066231A1

公开(公告)日：2021-03-04

申请号：US16846616

申请日：2020-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yunrae CHO ,  Jinyeol YANG ,  Jungmin KO ,  Seungduk BAEK

IPC: H01L23/00

Abstract: An integrated circuit device includes a wiring structure, first and second inter-wiring insulating layers, redistributions patterns and a cover insulating layer. The wiring structure includes wiring layers having a multilayer wiring structure and via plugs. The first inter-wiring insulating layer that surrounds the wiring structure on a substrate. The second inter-wiring insulating layer is on the first inter-wiring insulating layer, and redistribution via plugs are connected to the wiring structure through the second inter-wiring insulating layer. The redistribution patterns includes pad patterns and dummy patterns on the second inter-wiring insulating layer. Each patterns has a thickness greater than a thickness of each wiring layer. The cover insulating layer covers some of the redistribution patterns. The dummy patterns are in the form of lines that extend in a horizontal direction parallel to the substrate.