公开(公告)号：US11035882B2

公开(公告)日：2021-06-15

申请号：US16430618

申请日：2019-06-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Hyun Kim ,  Jong-Jin An

IPC: G01R1/04 ,  G01R31/26 ,  G01R31/28

Abstract: A signal transfer structure including a tapered input line extending in a first direction and having an input terminal and a contact terminal, a width of the input line increasing from the input terminal to the contact terminal in the first direction and a signal being input to the input terminal; a diverging line in contact with the contact terminal of the input line and extending in a second direction different from the first direction; an output line connected to the diverging line and from which the signal is output; and an interconnector, the interconnector including a vertical via between the diverging line and the output line and a via line connected to the vertical via and having a same characteristic impedance as the output line.