HINGE STRUCTURE WITH AIR VENT AND ELECTRONIC DEVICE HAVING THE SAME

    公开(公告)号:US20230280804A1

    公开(公告)日:2023-09-07

    申请号:US18318003

    申请日:2023-05-16

    IPC分类号: G06F1/20 H05K7/20 G06F1/16

    摘要: An electronic device includes first and second housings rotatable relative to each other, a fan inside the housing, and a hinge structure rotatably connecting the first and second housings to each other. The hinge structure includes a vent member rotating together with rotation of the first and second housings. The vent member includes first and second portions which guide first air flow between intake and exhaust openings together with operation of the fan. The first and second housings which face each other define a first angle therebetween, the first and second housings which are maximally rotated define a second angle therebetween, and the first and second housings forming a third angle between the first angle and the second angle, rotates the vent member to dispose the first and second vent portions together guiding air flow in different directions, relative to the front side of the electronic device.

    TEST CHAMBER AND TEST APPARATUS HAVING THE SAME

    公开(公告)号:US20200271715A1

    公开(公告)日:2020-08-27

    申请号:US16561741

    申请日:2019-09-05

    IPC分类号: G01R31/26

    摘要: Disclosed are a test chamber and a test apparatus having the same. The test chamber includes a test compartment configured to support a plurality of test boards, each being configured to secure a test object. The test chamber applies a test signal to the test object. The test chamber includes an inlet side and a discharge side, and a supply duct vertically extending along a height of the test compartment. The supply duct supplies the inlet side of the test compartment with the test fluid. The test chamber includes a fluid controller to uniformly control a distribution of a test fluid in the supply duct and uniformly supply the test compartment with the test fluid. The disclosed test chamber and test apparatus provide a uniform test temperature and thereby improve a test reliability of a test object such as a semiconductor or semiconductor package.