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公开(公告)号:US20240098940A1
公开(公告)日:2024-03-21
申请号:US18375156
申请日:2023-09-29
发明人: Haein CHUNG , Junghan KANG , Bongjae RHEE , Jonghyun LIM
CPC分类号: H05K7/2049 , H04M1/0277 , H05K1/0203 , H05K7/20472 , H05K9/0015 , H05K9/0032 , H05K2201/10371
摘要: A printed circuit board (PCB) assembly includes a first circuit board, an electronic component provided on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure configured to apply a pre-load to the thermal module in a direction toward the electronic component, where the pressurizing structure is separated from the second circuit board and is supported by the first circuit board or an external structure.
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公开(公告)号:US20230280804A1
公开(公告)日:2023-09-07
申请号:US18318003
申请日:2023-05-16
发明人: Haein CHUNG , Hansang KIM , Kunwoo BAEK , Giyeon KO , Jonghyun LIM , Chihwan JEONG , Hui JEONG , Myoungjun CHOI
CPC分类号: G06F1/20 , G06F1/1616 , G06F1/1681 , H05K7/20145
摘要: An electronic device includes first and second housings rotatable relative to each other, a fan inside the housing, and a hinge structure rotatably connecting the first and second housings to each other. The hinge structure includes a vent member rotating together with rotation of the first and second housings. The vent member includes first and second portions which guide first air flow between intake and exhaust openings together with operation of the fan. The first and second housings which face each other define a first angle therebetween, the first and second housings which are maximally rotated define a second angle therebetween, and the first and second housings forming a third angle between the first angle and the second angle, rotates the vent member to dispose the first and second vent portions together guiding air flow in different directions, relative to the front side of the electronic device.
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公开(公告)号:US20200271715A1
公开(公告)日:2020-08-27
申请号:US16561741
申请日:2019-09-05
发明人: Seon-Mi LEE , Sung Jin KIM , Ja-Hwan KU , Jae-Hyun KIM , Gilho LEE , Dahm YU , Jonghyun LIM
IPC分类号: G01R31/26
摘要: Disclosed are a test chamber and a test apparatus having the same. The test chamber includes a test compartment configured to support a plurality of test boards, each being configured to secure a test object. The test chamber applies a test signal to the test object. The test chamber includes an inlet side and a discharge side, and a supply duct vertically extending along a height of the test compartment. The supply duct supplies the inlet side of the test compartment with the test fluid. The test chamber includes a fluid controller to uniformly control a distribution of a test fluid in the supply duct and uniformly supply the test compartment with the test fluid. The disclosed test chamber and test apparatus provide a uniform test temperature and thereby improve a test reliability of a test object such as a semiconductor or semiconductor package.
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