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公开(公告)号:US20180130932A1
公开(公告)日:2018-05-10
申请号:US15863724
申请日:2018-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Joon Woo JEON , Sang Seok LEE , Hyun Kwon HONG
CPC classification number: H01L33/62 , H01L33/24 , H01L33/38 , H01L33/44 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066
Abstract: A semiconductor light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and an insulating layer on the light emitting structure and including first and second through-holes. The insulating layer includes a first lower insulating layer and a second lower insulating layer. The first insulating layer is disposed on the first conductivity-type semiconductor layer and is surrounded by the second lower insulating layer with the first through-hole interposed therebetween.
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公开(公告)号:US20180040788A1
公开(公告)日:2018-02-08
申请号:US15443202
申请日:2017-02-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Joon Woo JEON , Sang Seok LEE , Hyun Kwon HONG
CPC classification number: H01L33/62 , H01L33/24 , H01L33/38 , H01L33/44 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066
Abstract: A semiconductor light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and an insulating layer on the light emitting structure and including first and second through-holes. The insulating layer includes a first lower insulating layer and a second lower insulating layer. The first insulating layer is disposed on the first conductivity-type semiconductor layer and is surrounded by the second lower insulating layer with the first through-hole interposed therebetween.
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