公开(公告)号：US20230170232A1

公开(公告)日：2023-06-01

申请号：US18101709

申请日：2023-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Whan OH ,  Kyung-Won KANG ,  Hyeon Jun KANG ,  Ju Bong LEE ,  Sung Hun JANG ,  Seok HEO ,  Hyun Woong HWANG

IPC: H01L21/67 ,  B05B12/12 ,  H01L21/68

CPC classification number: H01L21/67259 ,  B05B12/124 ,  H01L21/681 ,  H01L21/6715 ,  B25J11/0075

Abstract: A manufacturing apparatus for a semiconductor device, the manufacturing apparatus including a spin chuck configured to fix and rotate a wafer; a nozzle configured to spray a chemical toward the wafer; a lateral displacement sensor configured to measure a displacement variation to a lateral surface of the wafer while the spin chuck is rotating; and a controller configured to control a position of the nozzle by using the displacement variation while the spin chuck is rotating.