公开(公告)号：US11456202B2

公开(公告)日：2022-09-27

申请号：US17330940

申请日：2021-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-San Jung ,  Hyunseok Choi ,  Jun-Su Lim

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/687 ,  H01L21/67 ,  B05B5/08

Abstract: A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.

公开(公告)号：US20200303209A1

公开(公告)日：2020-09-24

申请号：US16657708

申请日：2019-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung-Hak Lee ,  Jaeyong Park ,  Jun-Su Lim ,  Sungil Cho

IPC: H01L21/463 ,  H01L21/683 ,  H01L21/52 ,  H01L21/48 ,  H01L21/56

Abstract: A method of fabricating a semiconductor device is provided in which an adhesive layer is disposed on a first surface of a first semiconductor substrate. A carrier substrate is provided on the first surface of the first semiconductor substrate, and the carrier substrate is separated from a surface of the adhesive layer while the adhesive layer is still attached to the first surface of the first semiconductor substrate.