-
公开(公告)号:US11289632B2
公开(公告)日:2022-03-29
申请号:US16768424
申请日:2018-11-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyung Hoon Cha , Won Yong Lee , Won Soon Park , Jung-Hoon Yoon , Tack Mo Lee
IPC: H01L33/52 , H01L25/075 , H01L33/60
Abstract: Provided is a display apparatus including a substrate, a plurality of light emitting device (LED) elements arranged in front of the substrate, a transmission layer formed on a front surface of the substrate to entirely cover the plurality of LED elements, a first polarization member arranged in front of the transmission layer, and a second polarization member arranged on a front surface of the first polarization member and allowing external light to be incident thereon, wherein the transmission layer is provided such that polarization of external light polarized through the second polarization member and the first polarization member is maintained in a course of the polarized external light passing through the transmission layer, being reflected by the front surface of the substrate or the plurality of LED elements and being directed to the first polarization member.
-
公开(公告)号:US10797199B2
公开(公告)日:2020-10-06
申请号:US16038932
申请日:2018-07-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jung-Hoon Yoon , Kyung Hoon Cha
IPC: H01L33/00 , H01L21/683 , H01L23/00 , H01L25/075 , H01L33/62
Abstract: An apparatus and method capable of efficiently manufacturing a LED module. The method of manufacturing an Light Emitting Diode (LED) module includes preparing a substrate and a carrier on which an LED chip is disposed, disposing a mask on the substrate, the mask including an opening and a wall defining or forming the opening, picking up the LED chip from the carrier with a stamp, moving the LED chip picked up by the stamp to face the opening, moving the LED chip so that at least a part of the LED chip is inserted into the opening, and positioning the LED chip on the substrate by moving the LED chip so that the at least a part of the LED chip contacts the wall.
-