公开(公告)号：US11289632B2

公开(公告)日：2022-03-29

申请号：US16768424

申请日：2018-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Hoon Cha ,  Won Yong Lee ,  Won Soon Park ,  Jung-Hoon Yoon ,  Tack Mo Lee

IPC: H01L33/52 ,  H01L25/075 ,  H01L33/60

Abstract: Provided is a display apparatus including a substrate, a plurality of light emitting device (LED) elements arranged in front of the substrate, a transmission layer formed on a front surface of the substrate to entirely cover the plurality of LED elements, a first polarization member arranged in front of the transmission layer, and a second polarization member arranged on a front surface of the first polarization member and allowing external light to be incident thereon, wherein the transmission layer is provided such that polarization of external light polarized through the second polarization member and the first polarization member is maintained in a course of the polarized external light passing through the transmission layer, being reflected by the front surface of the substrate or the plurality of LED elements and being directed to the first polarization member.

公开(公告)号：US10983261B2

公开(公告)日：2021-04-20

申请号：US16467168

申请日：2017-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Hoon Cha ,  Sergey Shestak ,  Farid Mukhtarov

IPC: G02B5/30 ,  G02B30/25 ,  G02B5/02

Abstract: A panel device according to various embodiments of the disclosure includes a display panel including a plurality of pixels and a polarization panel including a first polarization pattern and a second polarization pattern and disposed on the display panel to allow a boundary line between the first polarization pattern and the second polarization pattern to divide each of the pixels into a first area corresponding to the first polarization pattern and a second area corresponding to the second polarization pattern.

公开(公告)号：US10797199B2

公开(公告)日：2020-10-06

申请号：US16038932

申请日：2018-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Hoon Yoon ,  Kyung Hoon Cha

IPC: H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

Abstract: An apparatus and method capable of efficiently manufacturing a LED module. The method of manufacturing an Light Emitting Diode (LED) module includes preparing a substrate and a carrier on which an LED chip is disposed, disposing a mask on the substrate, the mask including an opening and a wall defining or forming the opening, picking up the LED chip from the carrier with a stamp, moving the LED chip picked up by the stamp to face the opening, moving the LED chip so that at least a part of the LED chip is inserted into the opening, and positioning the LED chip on the substrate by moving the LED chip so that the at least a part of the LED chip contacts the wall.