公开(公告)号：US20190067538A1

公开(公告)日：2019-02-28

申请号：US15925037

申请日：2018-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-wook LEE ,  Geun-woo KO ,  Pun-jae CHOI ,  Jae-ho Han

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L33/36 ,  H01L33/50

Abstract: A light-emitting package includes a light-emitting structure having a first surface and a second surface opposite to the first surface. The light-emitting package further includes an electrode layer disposed on the first surface and an insulating layer disposed on the light-emitting structure and the electrode layer. The light-emitting package additionally includes an interconnection conductive layer penetrating the insulating layer and connected to the electrode layer and a reflective layer disposed between the insulating layer and the interconnection conductive layer. The reflective layer reflects light generated from the light-emitting structure in a direction toward the second surface.