公开(公告)号：US20240224544A1

公开(公告)日：2024-07-04

申请号：US18512199

申请日：2023-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KIHONG JEONG ,  Sangsub SONG ,  Heewoo AN

IPC: H10B80/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H10B80/00 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586

Abstract: A processor chip for a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface and mounted on a package substrate, and a plurality of chip pads disposed on the first surface of the substrate and electrically connected to the package substrate, wherein the first surface is divided into a first area and a second area, the first area includes four sides of the first surface and the second area includes a center of the first surface, and the plurality of chip pads are located on the first area and are arranged on at least a portion of a side of the first surface in a line along the side.