公开(公告)号：US20160162091A1

公开(公告)日：2016-06-09

申请号：US15040190

申请日：2016-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEONG-KYU HA ,  KWAN-JAi LEE ,  JAE-MIN JUNG ,  KYONG-SOON CHO ,  NA-RAE SHIN ,  KYOUNG-SUK YANG ,  PA-LAN LEE ,  SO-YOUNG LIM

IPC: G06F3/041 ,  G06F1/16

Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.

Abstract translation: 薄膜封装上的芯片包括柔性基膜，其具有彼此相对的第一表面和第二表面，所述第一表面和第二表面在其中包括至少一个通孔，分别设置在基膜的第一表面和第二表面上的多个布线 ，其包括通过所述至少一个通孔彼此连接的第一引线和第二引线，以及显示面板驱动芯片和触摸面板传感器芯片，每个安装在所述第一引线和所述第二表面中的任何一个上 其中所述显示面板驱动面板和所述触摸面板传感器芯片中的至少一个电连接到所述第一和第二引线。