公开(公告)号：US20160351155A1

公开(公告)日：2016-12-01

申请号：US15165464

申请日：2016-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JIN-WOO PARK ,  SO-YOUNG LIM

IPC: G09G3/36

CPC classification number: G09G3/3696 ,  G09G2300/0426 ,  G09G2330/021

Abstract: A chip on film (COF) package includes a base film, a semiconductor chip disposed on the base film, first signal wires, and second signal wires. The semiconductor chip includes a pads and a driving integrated circuit. The first signal wires are configured to output a drive signal generated in the driving integrated circuit, and are electrically connected to pads disposed in a first pad region. The first pad region is disposed on a first side of the semiconductor chip. The first signal wires are disposed on a first surface of the base film. The second signal wires are electrically connected to pads disposed in a second pad region. The second pad region is disposed on a second side of the semiconductor chip. The second signal wires are disposed on a second surface of the base film. The first and second surfaces of the base film are opposite to each other.

Abstract translation: 膜芯片（COF）封装包括基膜，设置在基膜上的半导体芯片，第一信号线和第二信号线。 半导体芯片包括焊盘和驱动集成电路。 第一信号线被配置为输出在驱动集成电路中产生的驱动信号，并且电连接到设置在第一焊盘区域中的焊盘。 第一焊盘区域设置在半导体芯片的第一侧上。 第一信号线设置在基膜的第一表面上。 第二信号线电连接到设置在第二焊盘区域中的焊盘。 第二焊盘区域设置在半导体芯片的第二侧上。 第二信号线设置在基膜的第二表面上。 基膜的第一和第二表面彼此相对。

公开(公告)号：US20160162091A1

公开(公告)日：2016-06-09

申请号：US15040190

申请日：2016-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEONG-KYU HA ,  KWAN-JAi LEE ,  JAE-MIN JUNG ,  KYONG-SOON CHO ,  NA-RAE SHIN ,  KYOUNG-SUK YANG ,  PA-LAN LEE ,  SO-YOUNG LIM

IPC: G06F3/041 ,  G06F1/16

Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.

Abstract translation: 薄膜封装上的芯片包括柔性基膜，其具有彼此相对的第一表面和第二表面，所述第一表面和第二表面在其中包括至少一个通孔，分别设置在基膜的第一表面和第二表面上的多个布线 ，其包括通过所述至少一个通孔彼此连接的第一引线和第二引线，以及显示面板驱动芯片和触摸面板传感器芯片，每个安装在所述第一引线和所述第二表面中的任何一个上 其中所述显示面板驱动面板和所述触摸面板传感器芯片中的至少一个电连接到所述第一和第二引线。