公开(公告)号：US20160162091A1

公开(公告)日：2016-06-09

申请号：US15040190

申请日：2016-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEONG-KYU HA ,  KWAN-JAi LEE ,  JAE-MIN JUNG ,  KYONG-SOON CHO ,  NA-RAE SHIN ,  KYOUNG-SUK YANG ,  PA-LAN LEE ,  SO-YOUNG LIM

IPC: G06F3/041 ,  G06F1/16

Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.

Abstract translation: 薄膜封装上的芯片包括柔性基膜，其具有彼此相对的第一表面和第二表面，所述第一表面和第二表面在其中包括至少一个通孔，分别设置在基膜的第一表面和第二表面上的多个布线 ，其包括通过所述至少一个通孔彼此连接的第一引线和第二引线，以及显示面板驱动芯片和触摸面板传感器芯片，每个安装在所述第一引线和所述第二表面中的任何一个上 其中所述显示面板驱动面板和所述触摸面板传感器芯片中的至少一个电连接到所述第一和第二引线。

公开(公告)号：US20140300849A1

公开(公告)日：2014-10-09

申请号：US14202167

申请日：2014-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-MIN JUNG ,  KYONG-SOON CHO ,  JEONG-KYU HA

IPC: H01L23/522 ,  H01L27/32 ,  G02F1/1345

CPC classification number: H01L27/3276 ,  G02F1/13452 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Provided are a chip-on-film (COF) package and a device assembly including the same. The device assembly includes a COF package including a film substrate on which a plurality of film-through wires are formed. The device assembly includes a panel unit including a panel substrate on which a plurality of panel-through wires are formed. The panel unit is disposed on the COF package. One end of the panel unit is electrically connected to a first end of the COF package. The device assembly includes a control unit disposed below the panel unit. One end of the control unit is electrically connected to a second end of the COF package.

Abstract translation: 提供了片上胶片（COF）包装和包括其的装置组件。 装置组件包括COF封装，其包括其上形成有多个胶片通孔的膜基板。 所述装置组件包括面板单元，所述面板单元包括其上形成有多个通孔导线的面板基板。 面板单元设置在COF包装上。 面板单元的一端电连接到COF封装的第一端。 设备组件包括设置在面板单元下方的控制单元。 控制单元的一端电连接到COF封装的第二端。