公开(公告)号：US10147616B2

公开(公告)日：2018-12-04

申请号：US14922406

申请日：2015-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soojae Park ,  Geunwoo Kim ,  Keunho Jang ,  Younjo Mun

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/13 ,  H01L21/50 ,  H01L23/498

Abstract: A package frame includes a plurality of unit regions disposed on one surface of the package frame, a peripheral region surrounding the unit regions on the one surface, and a wrinkled structure disposed on the one surface in the peripheral region. A first surface of the wrinkled structure extends from the one surface and is disposed at a different level than the one surface. Each of the unit regions includes a plurality of conductive pads.