公开(公告)号：US20170023633A1

公开(公告)日：2017-01-26

申请号：US15164926

申请日：2016-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ki-jae SONG

IPC: G01R31/26 ,  G01R1/04

CPC classification number: G01R31/2879 ,  G01R1/0433 ,  G01R31/2863

Abstract: A test board includes a plurality of power pads on a substrate. The power pads output a power supply voltage to a plurality of power terminals of a semiconductor device under test. The test board also includes a current limit circuit to limit current flowing through each of the power pads.

Abstract translation: 测试板包括在基板上的多个电源焊盘。 电源板向被测半导体器件的多个电源端子输出电源电压。 测试板还包括一个限流电路，用于限制流过每个电源板的电流。