公开(公告)号：US10203369B2

公开(公告)日：2019-02-12

申请号：US15089605

申请日：2016-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joo-sung Yun ,  Ki-jae Song ,  Ung-jin Jang ,  Woon-sup Choi ,  Jae-hyun Kim

IPC: G01R31/28 ,  G01R31/319

Abstract: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.