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公开(公告)号:US10203369B2
公开(公告)日:2019-02-12
申请号:US15089605
申请日:2016-04-04
发明人: Joo-sung Yun , Ki-jae Song , Ung-jin Jang , Woon-sup Choi , Jae-hyun Kim
IPC分类号: G01R31/28 , G01R31/319
摘要: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.
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2.
公开(公告)号:US10088521B2
公开(公告)日:2018-10-02
申请号:US15455550
申请日:2017-03-10
发明人: Joo-sung Yun , Woon-sup Choi , Moon-ho Lee , Seong-seob Shin
摘要: A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.
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