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公开(公告)号：US20240334588A1
公开(公告)日：2024-10-03
申请号：US18739889
申请日：2024-06-11
发明人： Jichul KIM , Jaeheung YE , Kyuhwan LEE , Kwangho JUNG
CPC分类号： H05K1/0203 , H05K1/145 , H05K1/181 , H05K7/20409 , H05K2201/10159 , H05K2201/10318 , H05K2201/10568
摘要： An electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.
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2.发明公开公开(公告)号：US20240306354A1
公开(公告)日：2024-09-12
申请号：US18666570
申请日：2024-05-16
发明人： Kwangho JUNG , Yongwon LEE , Jaeheung YE , Jinhwan JEON
CPC分类号： H05K9/0024 , H05K1/0218 , H05K1/18 , H05K2201/10189 , H05K2201/10242
摘要： An electronic device according to an embodiment includes a printed circuit board including a conductive layer and a conductive pad connected to the conductive layer and exposed to an outside of the printed circuit board; an electric component disposed on a first region of the printed circuit board and the electric component electrically connected to the printed circuit board; a conductive member disposed on the conductive pad and the conductive member surrounding at least part of a periphery of the first region of the printed circuit board; and a shielding member isolating the first region of the printed circuit board from the outside of the printed circuit board by covering the electric component and the conductive member, the shielding member electrically connected to the conductive layer. In addition, various embodiments are possible.
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