Surface mount pads for next generation speeds

    公开(公告)号:US11882655B2

    公开(公告)日:2024-01-23

    申请号:US16888644

    申请日:2020-05-29

    Abstract: A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

    Circuit board assembly, display apparatus, terminal, and signal processing system

    公开(公告)号:US11839026B2

    公开(公告)日:2023-12-05

    申请号:US17629792

    申请日:2021-03-11

    CPC classification number: H05K1/141 G09G3/3225 H05K1/148 H05K2201/10318

    Abstract: Circuit board assembly, Display apparatus, Terminal, and Signal processing system. The circuit board assembly comprises a first circuit board, a second circuit board, a third circuit board, and multiple differential signal lines; the first circuit board comprises a first connector which comprises a first lead group comprising N first leads and a second lead group comprising N second lead; the second circuit board comprises a second connector which comprises a third lead group comprising N third leads and a fourth lead group comprising N fourth leads; multiple i-th leads and multiple (i+2)-th leads are in one-to-one correspondence, and the i-th leads and the corresponding (i+2)-th leads are arranged along a first direction; a first differential line of a j-th differential signal line is connected to the (2j−1)-th i-th lead and the (2j−1)-th (i+2)-th lead, its second differential line is connected to the 2j-th i-th lead and the 2j-th (i+2)-th lead.

    Electronic device with plug
    9.
    发明授权

    公开(公告)号:US09800002B2

    公开(公告)日:2017-10-24

    申请号:US15220215

    申请日:2016-07-26

    Inventor: Ching-Chi Cheng

    Abstract: An electronic device with a plug includes a casing, a connection member and a circuit board. The connection member is combined with the casing. The connection member includes a first surface, a second surface, at least two perforations and at least two insertion parts. The first surface and the second surface are opposed to each other. The at least two perforations run through the first surface and the second surface. The at least two insertion parts are fixed on the first surface, protruded externally from the first surface and aligned with the corresponding perforations. The circuit board is accommodated within an accommodation space of the casing, and includes at least two conducting terminals. The conducting terminals are penetrated through the corresponding perforations from the second surface of the connection member, received within the corresponding insertion parts and partially protruded out of the corresponding insertion parts.

    MULTIPOLAR LEAD PARTS AND BOARD COUPLING DEVICE

    公开(公告)号:US20170208687A1

    公开(公告)日:2017-07-20

    申请号:US15321253

    申请日:2015-09-10

    Applicant: NSK Ltd.

    Abstract: Multipolar lead parts having plural leads and a retaining member, wherein the retaining member includes a cylindrical portion so as to cover peripheries of the leads, the cylindrical portion facing in a board direction; wherein the leads each include an upper-side board coupling portion and a lower-side board coupling portion; wherein the lower-side board coupling portion comprises a forward protruding portion that the other end side of each of the leads is bent in a direction orthogonal to an arrangement face of the leads, a vertical portion extending downward from a front end, a solder coupling portion extending backward from a lower end, and a rising portion extending upward from the solder coupling portion; and wherein a bending angle of the rising portion with respect to the solder coupling portion is formed so as to be substantially identical to a bending angle of the vertical portion with respect to the solder coupling portion.

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