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公开(公告)号:US12102117B2
公开(公告)日:2024-10-01
申请号:US18186722
申请日:2023-03-20
Applicant: Pax Labs, Inc.
Inventor: Joshua Fu , Christopher Loental , Marko Markovic , Alexander Weiss , Alexander Ringrose , David Carlberg , Robyn Nariyoshi , Devin Spratt , Nicholas J. Hatton , Yen Jen Chang , Chen Yu Li , Barry Tseng , Prince Wang , Thomas Germann , Andreas Schaefer
IPC: A24D1/14 , A24F7/00 , A24F40/40 , A61M11/04 , A61M15/00 , G01N35/00 , G08B6/00 , H01R13/52 , H02J7/00 , H05B1/02 , H05B3/00 , H05K1/14 , H05K1/18 , A24F15/015 , A24F40/10 , F16J15/02 , F17C9/02 , G01L13/00 , G01P15/00 , H01Q1/22
CPC classification number: A24D1/14 , A24F7/00 , A24F40/40 , A61M11/042 , A61M15/0028 , G01N35/00732 , G08B6/00 , H01R13/521 , H02J7/00 , H05B1/0244 , H05B3/0014 , H05B3/0019 , H05K1/147 , H05K1/189 , A24F15/015 , A24F40/10 , A61M2205/8206 , F16J15/02 , F17C9/02 , G01L13/00 , G01P15/00 , H01Q1/2283 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10189 , H05K2201/10318
Abstract: A vaporizer device may include a pressure sensor and an ambient pressure sensor. The pressure sensor may be configured to measure a first pressure in an air flow path in the vaporizer device. The ambient pressure sensor may be configured to measure a second pressure corresponding to an atmospheric pressure. The vaporizer device may further include a controller. The controller may be configured to transition the vaporizer device to a first standby mode when the first pressure is equal to or greater than the second pressure for a first threshold quantity of time. While the vaporizer device is in the first standby mode, the controller may be further configured to transition the vaporizer device to a second standby mode when the second pressure is a threshold quantity greater than the first pressure and no motion event is detected for a second threshold quantity of time.
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公开(公告)号:US20240298403A1
公开(公告)日:2024-09-05
申请号:US18560671
申请日:2021-05-13
Inventor: Yunyun LIANG , Changcheng LIU , Jiantao LIU , Liugang ZHOU , Jianwei SUN , Liu HE , Jun WANG , Qing LI , Yu QUAN , Yanting HUANG , Yunlu CHEN , Zhengru PAN
CPC classification number: H05K1/0269 , H05K1/189 , H05K2201/10128 , H05K2201/10318
Abstract: The present disclosure provides a circuit board, a chip on film, a display apparatus and a bonding method. The circuit board has a plurality of bonding regions for bonding with a chip on film, each bonding region includes: a plurality of first pins extending along a first direction and sequentially arranged along a second direction; and at least one first alignment mark group on an arrangement path along which the plurality of first pins are arranged and configured to be aligned with a second alignment mark group of the chip on film in a buckled way, so that the plurality of first pins are bonded and attached to second pins of the chip on film in one-to-one correspondence.
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公开(公告)号:US11882655B2
公开(公告)日:2024-01-23
申请号:US16888644
申请日:2020-05-29
Applicant: DELL PRODUCTS L.P.
Inventor: Umesh Chandra , Douglas Wallace , Bhyrav Mutnury
CPC classification number: H05K1/111 , H05K1/025 , H05K1/0215 , H05K2201/10318 , H05K2201/10636
Abstract: A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.
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公开(公告)号:US11839026B2
公开(公告)日:2023-12-05
申请号:US17629792
申请日:2021-03-11
Inventor: Zhongjie Wang , Fan Peng
IPC: H05K1/14 , G09G3/3225
CPC classification number: H05K1/141 , G09G3/3225 , H05K1/148 , H05K2201/10318
Abstract: Circuit board assembly, Display apparatus, Terminal, and Signal processing system. The circuit board assembly comprises a first circuit board, a second circuit board, a third circuit board, and multiple differential signal lines; the first circuit board comprises a first connector which comprises a first lead group comprising N first leads and a second lead group comprising N second lead; the second circuit board comprises a second connector which comprises a third lead group comprising N third leads and a fourth lead group comprising N fourth leads; multiple i-th leads and multiple (i+2)-th leads are in one-to-one correspondence, and the i-th leads and the corresponding (i+2)-th leads are arranged along a first direction; a first differential line of a j-th differential signal line is connected to the (2j−1)-th i-th lead and the (2j−1)-th (i+2)-th lead, its second differential line is connected to the 2j-th i-th lead and the 2j-th (i+2)-th lead.
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5.
公开(公告)号:US20180235088A1
公开(公告)日:2018-08-16
申请号:US15953823
申请日:2018-04-16
Inventor: Wenzhen Zhang
IPC: H05K1/18 , H05K1/02 , H05K3/36 , H05K1/14 , H04M1/02 , H05K5/03 , H05K3/30 , H05K1/11 , G06F1/16 , G06K9/00
CPC classification number: H05K1/189 , G06F1/1684 , G06F2203/0338 , G06K9/00 , G06K9/00006 , H04M1/026 , H04M2250/12 , H05K1/0281 , H05K1/111 , H05K1/144 , H05K3/301 , H05K3/305 , H05K3/363 , H05K5/03 , H05K2201/041 , H05K2201/10151 , H05K2201/10318 , H05K2201/10325 , H05K2201/10757
Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. The cover plate defines an assembling region. The fingerprint chip is fixed in the assembling region and has a plurality of pads. The intermediate board is bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate. The fingerprint chip is electrically connected to the intermediate board via the pads. The circuit board is electrically connected to the fingerprint chip via the intermediate board. The pads are connected to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip.
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公开(公告)号:US20180220545A1
公开(公告)日:2018-08-02
申请号:US15936100
申请日:2018-03-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Guodong ZHANG , Jian ZHANG , Jianping SHU
CPC classification number: H05K7/1439 , H01R12/7005 , H01R12/75 , H01R12/79 , H04Q1/15 , H05K1/141 , H05K1/18 , H05K7/1449 , H05K7/1451 , H05K7/1452 , H05K2201/044 , H05K2201/10318 , H05K2201/10356
Abstract: A backplane and a communications device are disclosed. In one example, the backplane includes at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by the flexible cables. Each of the connectors is provided with a housing, and multiple signal pins are installed on the housing. The housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device. One end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable.
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7.
公开(公告)号:US20180199431A1
公开(公告)日:2018-07-12
申请号:US15740378
申请日:2016-05-20
Applicant: OSRAM GmbH
Inventor: Michael Schoewel , Peter Helbig , Jozsef Szekely , Sven Seifritz
CPC classification number: H05K1/0296 , F21S41/19 , F21V21/00 , H05K1/181 , H05K3/0014 , H05K3/202 , H05K3/4092 , H05K13/0069 , H05K2201/0367 , H05K2201/0397 , H05K2201/09063 , H05K2201/09118 , H05K2201/10113 , H05K2201/10318 , H05K2203/166
Abstract: Various embodiments relate to a circuit support for an electronic circuit. The circuit support may include at least one conductor track, and an insulating matrix that is injection-molded over the at least one conductor path in such a way as to leave open at least a first region for connecting at least one electronic component of the electronic circuit. The circuit support may include at least one fastening aid that is formed from the material for the insulating matrix and/or from the material of the at least one conductor.
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8.
公开(公告)号:US20180054896A1
公开(公告)日:2018-02-22
申请号:US15677415
申请日:2017-08-15
Inventor: Wenzhen Zhang
CPC classification number: H05K1/189 , G06F1/1684 , G06F2203/0338 , G06K9/00006 , G06K9/00053 , H04M1/026 , H04M2250/12 , H05K1/0281 , H05K1/111 , H05K1/144 , H05K3/301 , H05K3/305 , H05K3/363 , H05K5/03 , H05K2201/041 , H05K2201/10151 , H05K2201/10318 , H05K2201/10325 , H05K2201/10757
Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.
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公开(公告)号:US09800002B2
公开(公告)日:2017-10-24
申请号:US15220215
申请日:2016-07-26
Applicant: Ching-Chi Cheng
Inventor: Ching-Chi Cheng
IPC: H01R25/00 , H01R24/68 , H01R12/70 , H01R13/04 , H01R13/11 , H01R31/06 , H01R12/71 , H01R103/00 , H05K1/11
CPC classification number: H01R24/68 , H01R12/7088 , H01R12/716 , H01R13/04 , H01R13/113 , H01R31/06 , H01R2103/00 , H05K1/117 , H05K2201/10189 , H05K2201/10318
Abstract: An electronic device with a plug includes a casing, a connection member and a circuit board. The connection member is combined with the casing. The connection member includes a first surface, a second surface, at least two perforations and at least two insertion parts. The first surface and the second surface are opposed to each other. The at least two perforations run through the first surface and the second surface. The at least two insertion parts are fixed on the first surface, protruded externally from the first surface and aligned with the corresponding perforations. The circuit board is accommodated within an accommodation space of the casing, and includes at least two conducting terminals. The conducting terminals are penetrated through the corresponding perforations from the second surface of the connection member, received within the corresponding insertion parts and partially protruded out of the corresponding insertion parts.
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公开(公告)号:US20170208687A1
公开(公告)日:2017-07-20
申请号:US15321253
申请日:2015-09-10
Applicant: NSK Ltd.
Inventor: Masakazu MORIMOTO , Noboru KANEKO , Tadayoshi OSAKABE
IPC: H05K1/18
CPC classification number: H05K1/18 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/707 , H01R13/405 , H01R43/24 , H01R2201/26 , H05K1/144 , H05K3/3426 , H05K7/1432 , H05K2201/042 , H05K2201/10318
Abstract: Multipolar lead parts having plural leads and a retaining member, wherein the retaining member includes a cylindrical portion so as to cover peripheries of the leads, the cylindrical portion facing in a board direction; wherein the leads each include an upper-side board coupling portion and a lower-side board coupling portion; wherein the lower-side board coupling portion comprises a forward protruding portion that the other end side of each of the leads is bent in a direction orthogonal to an arrangement face of the leads, a vertical portion extending downward from a front end, a solder coupling portion extending backward from a lower end, and a rising portion extending upward from the solder coupling portion; and wherein a bending angle of the rising portion with respect to the solder coupling portion is formed so as to be substantially identical to a bending angle of the vertical portion with respect to the solder coupling portion.
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