公开(公告)号：US20240098912A1

公开(公告)日：2024-03-21

申请号：US18373776

申请日：2023-09-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhwan JEON ,  Kwangho Jung ,  Chihyun Cho ,  Sangwon Ha

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K5/0069 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/284 ,  H05K3/341 ,  H05K5/0086 ,  H05K2201/09372 ,  H05K2201/10007

Abstract: An electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. In the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.