SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230005828A1

    公开(公告)日:2023-01-05

    申请号:US17693867

    申请日:2022-03-14

    Abstract: A semiconductor package includes a semiconductor chip; and a redistribution substrate connected to the semiconductor chip, the redistribution structure including a conductive structure including a lower conductive pattern and a redistribution structure on the lower conductive pattern and electrically connected to the lower conductive pattern, an insulating structure covering at least a side surface of the lower conductive pattern or a side surface of the redistribution structure, and a protective layer between the insulating structure and at least one of the lower conductive pattern or the redistribution structure. The protective layer including a first protective layer in contact with at least one of a side surface of the lower conductive pattern or a side surface of the redistribution structure, and a second protective layer in contact with at least a portion of a side surface of the first protective layer.

    DISPLAY MODULE CAPABLE OF RECOGNIZING PEN INPUT DEVICE AND ELECTRONIC DEVICE INCLUDING SAME

    公开(公告)号:US20220253161A1

    公开(公告)日:2022-08-11

    申请号:US17585562

    申请日:2022-01-27

    Abstract: An electronic device includes: a display panel including a first area, a second area, and a third area bendable and between the first area and the second area a first support part under the display panel; a recognition member including a first recognition member under the first area, and a second recognition member spaced apart from the first recognition member and under the second area, where the recognition member is under the first support part and recognizes a signal of a pen input device; a second support part including a first portion under the first recognition member, and a second portion spaced apart from the first portion and under the second recognition member; a first printed circuit board electrically connected to the first portion; and a second printed circuit board spaced apart from the first printed circuit board and electrically connected to the second portion.

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