公开(公告)号：US20240203855A1

公开(公告)日：2024-06-20

申请号：US18356721

申请日：2023-07-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jaemok JUNG ,  Un-Byoung KANG ,  Dowan KIM ,  Sung Keun PARK ,  Jongho PARK ,  Ju-Il CHOI

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/565 ,  H01L21/76811 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/08 ,  H01L24/32 ,  H01L2224/08055 ,  H01L2224/08155 ,  H01L2224/32146 ,  H01L2224/32235 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/182

摘要： An embodiment provides a semiconductor package including: a first redistribution layer substrate; a semiconductor chip on the first redistribution layer substrate; a coupling member on the first redistribution layer substrate, wherein the coupling member is spaced apart from the semiconductor chip; an encapsulant on the first redistribution layer substrate, the semiconductor chip, and the coupling member; and a second redistribution layer substrate on the encapsulant, wherein the coupling member includes a vertical wire and a metal portion extending around the vertical wire, and wherein a first end of the coupling member is electrically connected to the first redistribution layer substrate, and a second end of the coupling member is electrically connected to the second redistribution layer substrate.

公开(公告)号：US20240137349A1

公开(公告)日：2024-04-25

申请号：US18492294

申请日：2023-10-22

申请人： Samsung Electronics Co., Ltd.

发明人： Dowan KIM ,  Jinsoo KIM ,  Sooyong EOM ,  Yoserb YI ,  Jubong LEE ,  Seokhyun KIM ,  Junhyung PARK ,  Gajin SONG ,  Sunkey LEE

IPC分类号： H04L9/40 ,  H04L9/08 ,  H04L9/32 ,  H04L61/5007 ,  H04L67/02

CPC分类号： H04L63/0428 ,  H04L9/0825 ,  H04L9/3213 ,  H04L61/5007 ,  H04L63/166 ,  H04L67/02

摘要： An electronic device includes a communication circuit, and at least one processor connected to the communication circuit. The at least one processor may be configured to broadcast a device identification (ID) of the electronic device and an Internet protocol (IP) address of the electronic device through the communication circuit. The at least one processor may be configured to receive a token encrypted by an external electronic device and data of the external electronic device through the communication circuit. The at least one processor may be configured to decrypt the encrypted token by using a private key of the electronic device. The at least one processor may be configured to transmit the data of the external electronic device to a server in a cloud by using the decrypted token through the communication circuit.

公开(公告)号：US20240032217A1

公开(公告)日：2024-01-25

申请号：US18143933

申请日：2023-05-05

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Dowan KIM ,  Kiwoong KIM ,  Yoonah KIM ,  Chiun PARK ,  Kwangsung HWANG

IPC分类号： H05K5/02 ,  H05K5/00 ,  H01L25/075

CPC分类号： H05K5/0217 ,  H05K5/0021 ,  H01L25/0753

摘要： A display apparatus includes: a display module including a substrate on which a plurality of light emitting diodes (LEDs) are mounted; a cabinet provided to support the display module; and a circuit case attached to the cabinet. The display module is provided to be detachable from and mountable on a front side of the cabinet, and the display module is provided to be detachable from and mountable on a rear side of the cabinet.

公开(公告)号：US20230171124A1

公开(公告)日：2023-06-01

申请号：US18098980

申请日：2023-01-19

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sunghyun HONG ,  Dowan KIM ,  Junsuk KIM ,  Hyuncheol PARK ,  Hwajeong SON ,  Eunmo YANG ,  Donghyun LEE

IPC分类号： H04L12/28 ,  G05B15/02

CPC分类号： H04L12/282 ,  G05B15/02 ,  G05B2219/2642

摘要： An electronic device may include a communication module communicating with at least one of a first external electronic device and a second external electronic device, wherein the first external electronic device may perform a first operation, a database storing information related to at least one associated device and at least one associated operation for controlling the at least one associated device with a specified command in response to a specified operation of the first external electronic device, wherein the at least one associated device may include the second external electronic device and wherein the at least one associated operation may include a second operation, and at least one processor, wherein the at least one processor may identify that a first operation of the first external electronic device is executed, identify, from the database, a second external electronic device that is an associated device corresponding to the first operation of the first external electronic device and a second operation that is an associated operation in response to identifying that the first external electronic device is located in a specified space and satisfies an associated operation execution condition, and transmit a command for executing the second operation to the second external electronic device through the communication module.

公开(公告)号：US20230224053A1

公开(公告)日：2023-07-13

申请号：US18187974

申请日：2023-03-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Dowan KIM ,  Junsuk KIM ,  Hyuncheol PARK ,  Gyeongmin PYEON

IPC分类号： H04B17/27 ,  H04W64/00 ,  H04B17/26

CPC分类号： H04B17/27 ,  H04W64/003 ,  H04B17/26

摘要： Provided are a method of determining a location of a device and/or an electronic device for performing the method. An electronic device according to various example embodiments may include a processor, a communication module which may communicate with a device stored in a memory, wherein the memory which is electronically connected to the processor and stores the device and an instruction to be executed by the processor, and the memory, when operated by the processor, may identify a location of the electronic device in a plurality of areas where the device may be located, determine a candidate location of the device in the plurality of areas based on a signal received from the device and the location of the electronic device, collect a control history of the device using the communication module, and determine the location of the device among the candidate locations based on the control history and the location of the electronic device.

公开(公告)号：US20220230912A1

公开(公告)日：2022-07-21

申请号：US17714546

申请日：2022-04-06

申请人： Samsung Electronics Co., Ltd.

发明人： Dowan KIM ,  Doohwan LEE ,  Seunghwan BAEK

IPC分类号： H01L21/768 ,  H01L23/538 ,  H01L23/00 ,  H01L23/31

摘要： A method of manufacturing a semiconductor package may include forming a first substrate including a redistribution layer, providing a second substrate including a semiconductor chip and an interconnection layer on the first substrate to connect the semiconductor chip to the redistribution layer, forming a first encapsulation layer covering the second substrate, and forming a via structure penetrating the first encapsulation layer. The forming the via structure may include forming a first via hole in the first encapsulation layer, forming a photosensitive material layer in the first via hole, exposing and developing the photosensitive material layer in the first via hole to form a second encapsulation layer having a second via hole, and filling the second via hole with a conductive material. A surface roughness of a sidewall of the first encapsulation layer may be greater than a surface roughness of a sidewall of the second encapsulation layer.

公开(公告)号：US20230267632A1

公开(公告)日：2023-08-24

申请号：US18309234

申请日：2023-04-28

申请人： Samsung Electronics Co., Ltd.

发明人： Taehwa HONG ,  Dowan KIM ,  Kimin KIM

IPC分类号： G06T7/593 ,  G06T7/73

CPC分类号： G06T7/593 ,  G06T7/73 ,  G06T2207/10012 ,  G06T2207/30201

摘要： An image processing device is provided. The image processing device includes a camera configured to obtain a stereo image, an eye-tracking sensor configured to obtain gaze information of a user, a memory storing one or more instructions, and at least one processor. The at least one processor is configured to, by executing one or more instructions, extract feature points from the stereo image and generate gaze coordinate information in which gaze coordinates corresponding to the gaze information of the user are accumulated on the stereo image, and perform stereo matching based on the feature points and the gaze coordinate information.

公开(公告)号：US20230160717A1

公开(公告)日：2023-05-25

申请号：US18065229

申请日：2022-12-13

申请人： Samsung Electronics Co., Ltd.

发明人： Sunghyun HONG ,  Dowan KIM ,  Junsuk KIM ,  Eunmo YANG ,  Donghyun LEE ,  Hyuncheol PARK ,  Hwajeong SON

IPC分类号： G01C21/00

CPC分类号： G01C21/383 ,  G01C21/3841

摘要： An electronic device is provided. The electronic device includes a communication module, a processor, and a memory storing instructions, the electronic device receives information indicating that a first external electronic device entered a designated space, from at least one anchor in the designated space, in response to receiving the information, establishes a communication connection with the first external electronic device using the communication module, after establishing the communication connection with the first external electronic device, receives a request of use authority of a first device among devices positioned in the designated space from the first external electronic device, identifies use authority set for the first external electronic device, based on information on the first device and information on the first external electronic device, and transmits information to the first external electronic device and the first device so the set use authority is applied to the first external electronic device.

公开(公告)号：US20220197377A1

公开(公告)日：2022-06-23

申请号：US17561329

申请日：2021-12-23

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Kimin KIM ,  Dowan KIM ,  Bonkon KOO ,  Taehwa HONG

IPC分类号： G06F3/01 ,  G06V40/18 ,  G09G3/20

摘要： An augmented reality (AR) device is provided. The AR device includes a display module configured to output light of a virtual image, a waveguide configured to transmit the output light of the virtual image to an eye of a user and to pass external light therethrough, a gaze tracking sensor configured to obtain information on the eye of the user, the information including a pupil size, a memory storing instructions, and a processor configured to execute the instructions to control the display module to adjust a brightness of the light of the virtual image based on the pupil size.

公开(公告)号：US20240213223A1

公开(公告)日：2024-06-27

申请号：US18516367

申请日：2023-11-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jaemok JUNG ,  Dowan KIM ,  Sungkeun PARK ,  Jongho PARK ,  Juil CHOI

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522

CPC分类号： H01L25/0657 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5226 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/08056 ,  H01L2224/08245 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06544 ,  H01L2924/181

摘要： A semiconductor package includes a first redistribution wiring layer having a first region and a second region surrounding the first region, a semiconductor chip disposed on the first region of the first redistribution wiring layer, a sealing member covering the semiconductor chip on the first redistribution wiring layer, vertical conductive wires penetrating the sealing member on the second region of the first redistribution wiring layer, a second redistribution wiring layer disposed on the sealing member and including second redistribution wirings electrically connected to the vertical conductive wires, and bonding pads provided on an upper surface of the first redistribution wiring layer or a lower surface of the second redistribution wiring layer, each bonding pad having a concavo-convex pattern on an upper surface of the bonding pad. The vertical conductive wires are bonded to the concavo-convex patterns of the bonding pads, respectively.