公开(公告)号：US20250140579A1

公开(公告)日：2025-05-01

申请号：US18737254

申请日：2024-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunghwan Kim ,  Kyungwon Kang ,  Dongwook Kim ,  Seok Heo

IPC: H01L21/67 ,  H01L21/683

Abstract: Provided are a wafer cleaning device and a method of optimizing the same. The wafer cleaning device includes an upper nozzle configured to spray a cleaning solution onto a front surface of a wafer, a spin chuck provided below the wafer to rotate the wafer and configured to heat a central region of the wafer, and a plurality of lower nozzles provided below the wafer to spray a temperature control liquid having a higher temperature than the cleaning solution onto a rear surface of the wafer, the plurality of lower nozzles configured to heat an outer region of the wafer that surrounds the central region of the wafer. A temperature gradient formed by the spin chuck and the plurality of lower nozzles causes a cleaning solution to flow in a cleaning solution layer on the front surface of the wafer.

公开(公告)号：US20250028257A1

公开(公告)日：2025-01-23

申请号：US18436744

申请日：2024-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungwhan Oh ,  Dahae Lee ,  Eunhee Jeang ,  Chulmin Cho ,  Kyungwon Kang

IPC: G03F7/00 ,  G03F7/20

Abstract: A semiconductor process apparatus includes a light generator configured to output extreme ultraviolet (EUV) light having an EUV wavelength band, a mask stage configured to seat a mask reflecting the EUV light output from the light generator, a light-receiving optical unit including a plurality of mirrors generating output light by reflecting the EUV light reflected from the mask, at least one of the plurality of mirrors including a mirror body and a reflective layer attached to a surface of the mirror body, a power supply configured to apply a bias voltage to the reflective layer, and a substrate stage configured to seat a substrate to be irradiated with the output light.