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公开(公告)号:US20240105469A1
公开(公告)日:2024-03-28
申请号:US18358160
申请日:2023-07-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Takashi Sasa , Kyoungwhan Oh , Hokyun Kim
CPC classification number: H01L21/67023 , B01D19/0031 , B01D19/0063 , B01D19/0068
Abstract: A liquid supply system includes a liquid supply unit; a liquid pressurizer connected to the liquid supply unit; a compressor connected to the liquid pressurizer; a pump at a rear end of the liquid pressurizer to allow liquid to flow; an inflow control valve between the liquid supply unit and the liquid pressurizer; and an outflow control valve between the liquid pressurizer and the pump, wherein the liquid pressurizer is configured to supply liquid having a dissolved gas concentration that is lower than a dissolved gas concentration of liquid supplied from the liquid supply unit to the pump.
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公开(公告)号:US20230138834A1
公开(公告)日:2023-05-04
申请号:US17864738
申请日:2022-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungwoo Cho , Minwoo Rhee , Hyunjin Lee , Seungdon Lee , Sujie Kang , Sunwoo Park , Kyoungwhan Oh , Jungshin Lee , Juhyung Lee
IPC: B29C64/277 , B29C64/245 , B29C64/209 , B33Y30/00
Abstract: A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.
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公开(公告)号:US20250028257A1
公开(公告)日:2025-01-23
申请号:US18436744
申请日:2024-02-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoungwhan Oh , Dahae Lee , Eunhee Jeang , Chulmin Cho , Kyungwon Kang
Abstract: A semiconductor process apparatus includes a light generator configured to output extreme ultraviolet (EUV) light having an EUV wavelength band, a mask stage configured to seat a mask reflecting the EUV light output from the light generator, a light-receiving optical unit including a plurality of mirrors generating output light by reflecting the EUV light reflected from the mask, at least one of the plurality of mirrors including a mirror body and a reflective layer attached to a surface of the mirror body, a power supply configured to apply a bias voltage to the reflective layer, and a substrate stage configured to seat a substrate to be irradiated with the output light.
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公开(公告)号:US20240367376A1
公开(公告)日:2024-11-07
申请号:US18772836
申请日:2024-07-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungwoo Cho , Minwoo Rhee , Hyunjin Lee , Seungdon Lee , Sujie Kang , Sunwoo Park , Kyoungwhan Oh , Jungshin Lee , Juhyung Lee
IPC: B29C64/277 , B29C64/112 , B29C64/209 , B29C64/245 , B33Y30/00
Abstract: A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.
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公开(公告)号:US12070903B2
公开(公告)日:2024-08-27
申请号:US17864738
申请日:2022-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungwoo Cho , Minwoo Rhee , Hyunjin Lee , Seungdon Lee , Sujie Kang , Sunwoo Park , Kyoungwhan Oh , Jungshin Lee , Juhyung Lee
IPC: B29C64/277 , B29C64/112 , B29C64/209 , B29C64/245 , B33Y30/00
CPC classification number: B29C64/277 , B29C64/209 , B29C64/245 , B33Y30/00 , B29C64/112
Abstract: A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.
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公开(公告)号:US20250054878A1
公开(公告)日:2025-02-13
申请号:US18632437
申请日:2024-04-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sujie Kang , Minsoo Han , Minwoo Rhee , Kyoungwhan Oh , Kyeongbin Lim
Abstract: A warpage control method includes measuring displacement in a vertical direction perpendicular to a front surface of a wafer and dividing the front surface of the wafer into a first stress region with a negative displacement value and a second stress region with a positive displacement value, to thereby derive a warpage model, defining a portion of a region, overlapping the first stress region, on the front surface of the wafer as a first compensation region based on the warpage model and defining a region, other than the first compensation region, on the front surface of the wafer as a second compensation region based on the warpage model, to thereby derive a stress compensation film pattern model, and forming a mask pattern in a region on a back surface of the wafer.
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公开(公告)号:US20240079264A1
公开(公告)日:2024-03-07
申请号:US18235603
申请日:2023-08-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jonggu Lee , Jeonggil Kim , Hyeonjin Kim , Kyoungwhan Oh
IPC: H01L21/687 , H01L21/67
CPC classification number: H01L21/68742 , H01L21/67288 , H01L21/68785
Abstract: A substrate supporting apparatus includes a stage table configured to support a substrate and including a plurality of openings, a plurality of lift pins disposed to be vertically movable through the plurality of openings and configured to support the substrate, a lift support positioned outside the stage table from a plan view and vertically movable to support the substrate, an actuator configured to vertically actuate the plurality of lift pins and the lift support so as to load the substrate onto the stage table, and a controller configured to control the actuator.
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