公开(公告)号：US20240038492A1

公开(公告)日：2024-02-01

申请号：US18121103

申请日：2023-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUNGJOON KIM ,  KIYONG KIM ,  YOUNGKWON KIM ,  JAEHYUN KIM ,  YOODONG YANG ,  MINSUCK YOO ,  JONGHYUN LEE ,  ILJUN JEON ,  HEE JONG JEONG

IPC: H01J37/32

CPC classification number: H01J37/32082 ,  H01J37/32532 ,  H01J37/32724 ,  H01J2237/3321

Abstract: A substrate supporting apparatus includes a heating plate, a radio frequency (RF) electrode in the heating plate, and an RF delivery structure in contact with a bottom surface of the RF electrode. The heating plate includes a first insertion hole, which is recessed into the heating plate from a bottom surface of the heating plate to expose the bottom surface of the RF electrode. The RF delivery structure includes an RF rod, a portion of which is inserted in the first insertion hole, and through which an RF power is supplied to the RF electrode. The RF rod includes a first material, and a relative permeability of the first material is less than 100, a volume resistivity of the first material is smaller than 70 nΩm, and a melting point of the first material is higher than 1400° C.