公开(公告)号：US11063174B2

公开(公告)日：2021-07-13

申请号：US16653449

申请日：2019-10-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Masaru Wada ,  Jamyeong Koo ,  Eunhye Kim ,  Sangmoo Park ,  Seona Yang ,  Minsub Oh ,  Yoonsuk Lee ,  Youngkyong Jo

IPC: H01L33/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/46

Abstract: A light emitting diode (LED) includes: a device substrate; a first semiconductor layer above the device substrate, and doped with an n-type dopant; a second semiconductor layer above the first semiconductor layer, and doped with a p-type dopant; an active layer between the first semiconductor layer and the second semiconductor layer and configured to provide light; a transparent electrode layer adjacent to an upper part of the second semiconductor layer; and a first electrode pad and a second electrode pad between the device substrate and the first semiconductor layer, the first electrode pad electronically connected with the first semiconductor layer and the second electrode pad electrically connected with the second semiconductor layer, wherein light provided by the active layer is irradiated to an outside in a direction from the active layer to the second semiconductor layer.

公开(公告)号：US11508780B2

公开(公告)日：2022-11-22

申请号：US16926169

申请日：2020-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takashi Takagi ,  Masaru Wada ,  Satoshi Yanagisawa ,  Tsubasa Fujiwara

IPC: H01L27/15 ,  G09F9/33

Abstract: A method of manufacturing a display apparatus, a display apparatus, and a structure for manufacturing a display apparatus are provided. The method of manufacturing a display apparatus includes: forming a micro-light-emitting diode (LED) chip on a relay substrate such that a chip-side electrode is exposed; transferring the micro-LED chip from the relay substrate to a driving substrate including a driving substrate-side electrode; and bonding the chip-side electrode to the driving substrate-side electrode.