公开(公告)号：US11508780B2

公开(公告)日：2022-11-22

申请号：US16926169

申请日：2020-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takashi Takagi ,  Masaru Wada ,  Satoshi Yanagisawa ,  Tsubasa Fujiwara

IPC: H01L27/15 ,  G09F9/33

Abstract: A method of manufacturing a display apparatus, a display apparatus, and a structure for manufacturing a display apparatus are provided. The method of manufacturing a display apparatus includes: forming a micro-light-emitting diode (LED) chip on a relay substrate such that a chip-side electrode is exposed; transferring the micro-LED chip from the relay substrate to a driving substrate including a driving substrate-side electrode; and bonding the chip-side electrode to the driving substrate-side electrode.

公开(公告)号：US11374149B2

公开(公告)日：2022-06-28

申请号：US16851321

申请日：2020-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takashi Takagi

IPC: H01L33/00 ,  H01L33/24 ,  H01L33/56

Abstract: Provided are a method of manufacturing a display device and a source substrate structure. The method of manufacturing the display device includes holding a light-emitting element on a source substrate that passes laser light of a certain wavelength therethrough, the holding being performed by a release layer between the source substrate and the light-emitting element, forming an adhesive layer on a driving substrate on which a driving substrate-side electrode is formed, moving the light-emitting element to a surface of the adhesive layer on the driving substrate from the source substrate by irradiating laser light of the certain wavelength to the release layer through the source substrate, and adhering the moved light-emitting element to the driving substrate by using the adhesive layer, and the release layer comprises a resin material with a thickness that is greater than or equal to 0.1 μm and is less than or equal to 0.5 μm.