公开(公告)号：US11508780B2

公开(公告)日：2022-11-22

申请号：US16926169

申请日：2020-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takashi Takagi ,  Masaru Wada ,  Satoshi Yanagisawa ,  Tsubasa Fujiwara

IPC: H01L27/15 ,  G09F9/33

Abstract: A method of manufacturing a display apparatus, a display apparatus, and a structure for manufacturing a display apparatus are provided. The method of manufacturing a display apparatus includes: forming a micro-light-emitting diode (LED) chip on a relay substrate such that a chip-side electrode is exposed; transferring the micro-LED chip from the relay substrate to a driving substrate including a driving substrate-side electrode; and bonding the chip-side electrode to the driving substrate-side electrode.