公开(公告)号：US10088521B2

公开(公告)日：2018-10-02

申请号：US15455550

申请日：2017-03-10

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Joo-sung Yun ,  Woon-sup Choi ,  Moon-ho Lee ,  Seong-seob Shin

IPC分类号： H01L23/58 ,  G06F19/00 ,  G01R31/302 ,  H02J7/02 ,  H01L21/66 ,  G01R1/04

摘要： A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.