公开(公告)号：US10692583B2

公开(公告)日：2020-06-23

申请号：US16169289

申请日：2018-10-24

申请人： Samsung Electronics Co., Ltd.

发明人： Seong-seob Shin

IPC分类号： G11C29/36 ,  G01R31/3187 ,  G01R31/317 ,  G11C29/10 ,  H01L25/065 ,  G11C7/18 ,  G11C29/40

摘要： Provided are a multi-channel package capable of reducing a test cost while performing a test at a high speed, and a test apparatus and a test method of testing the multi-channel package. The multi-channel package includes: a package substrate; and at least two semiconductor chips mounted on the package substrate and having different channels, wherein each of the at least two semiconductor chips includes a built-in-self-test (BIST) circuit and operates in one of a self-test mode, a tester mode, and a target mode during a test, and in the tester mode or the target mode, the at least two semiconductor chips are configured to be inter-channel cross-tested through an external signal path of the package substrate.

公开(公告)号：US10088521B2

公开(公告)日：2018-10-02

申请号：US15455550

申请日：2017-03-10

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Joo-sung Yun ,  Woon-sup Choi ,  Moon-ho Lee ,  Seong-seob Shin

IPC分类号： H01L23/58 ,  G06F19/00 ,  G01R31/302 ,  H02J7/02 ,  H01L21/66 ,  G01R1/04

摘要： A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.