公开(公告)号：US11569209B2

公开(公告)日：2023-01-31

申请号：US17236138

申请日：2021-04-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangsoo Kim ,  Sehun Ahn ,  Pilsung Choi ,  Sung-Kyu Park

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface. A semiconductor chip is on the first surface of the substrate. A passive element is on the second surface of the substrate. The substrate includes a first passive element pad and a second passive element pad that are exposed by the second surface. A dam extends downwardly from the second surface. The dam includes a first dam and a second dam. The passive element is disposed between the first dam and the second dam. The passive element includes a first electrode portion electrically connected to the first passive element pad. A second electrode portion is electrically connected to the second passive element pad.