公开(公告)号：US11210016B2

公开(公告)日：2021-12-28

申请号：US16544178

申请日：2019-08-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kui-Yon Mun ,  Sung-Kyu Park ,  Beom-Kyu Shin ,  Young-Seok Hong ,  Jae-Yong Jeong

IPC: G06F3/06 ,  G06F12/02

Abstract: A method of controlling a first memory controller that controls a non-volatile memory device includes: the first memory controller receiving first data and a first physical address from a second memory controller via a first interface of the first memory controller; the first memory controller storing the first data in a non-volatile memory buffer of the first memory controller; and the first memory controller programming the first data stored in the non-volatile memory buffer in a first physical region of the non-volatile memory device corresponding to the first physical address.

公开(公告)号：US20190080943A1

公开(公告)日：2019-03-14

申请号：US15894217

申请日：2018-02-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SANG-SOO KIM ,  Sung-Kyu Park ,  Seung-Hwan Kim ,  Yun-Young Kim ,  Jun-Woo Park

IPC: H01L21/67 ,  G01N21/3581 ,  G01N21/95

Abstract: A measurement device includes an emitter configured to emit an electromagnetic signal to an object to be measured. A first detector is disposed to measure a first portion of the electromagnetic signal that is reflected by the object to be measured. A second detector is disposed to measure a second portion of the electromagnetic signal that is transmitted through the object to be measured. The emitter is configured to emit the electromagnetic signal in a direction substantially perpendicular to a surface of the object to be measured.

公开(公告)号：US11086745B2

公开(公告)日：2021-08-10

申请号：US16573101

申请日：2019-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kui-Yon Mun ,  Jae-Yong Jeong ,  Sung-Kyu Park ,  Beomkyu Shin ,  Young-Seok Hong

IPC: G11C8/00 ,  G06F11/30 ,  G06F11/10 ,  G06F13/16 ,  G11C11/16 ,  G06F12/02

Abstract: A memory system includes a memory device, a first controller, and a second controller. The first controller is configured to output a control signal for the memory device and data to be stored in the memory device based on a signal received from a host. The second controller includes a non-volatile memory configured to store the data. The second controller is configured to receive the control signal and the data from the first controller, and control the memory device based on the control signal.

公开(公告)号：US20200241989A1

公开(公告)日：2020-07-30

申请号：US16573101

申请日：2019-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kui-Yon Mun ,  Jae-Yong Jeong ,  Sung-Kyu Park ,  Beomkyu Shin ,  Young-Seok Hong

IPC: G06F11/30 ,  G06F11/10 ,  G06F13/16 ,  G06F12/02 ,  G11C11/16

Abstract: A memory system includes a memory device, a first controller, and a second controller. The first controller is configured to output a control signal for the memory device and data to be stored in the memory device based on a signal received from a host. The second controller includes a non-volatile memory configured to store the data. The second controller is configured to receive the control signal and the data from the first controller, and control the memory device based on the control signal.

公开(公告)号：US11569209B2

公开(公告)日：2023-01-31

申请号：US17236138

申请日：2021-04-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangsoo Kim ,  Sehun Ahn ,  Pilsung Choi ,  Sung-Kyu Park

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface. A semiconductor chip is on the first surface of the substrate. A passive element is on the second surface of the substrate. The substrate includes a first passive element pad and a second passive element pad that are exposed by the second surface. A dam extends downwardly from the second surface. The dam includes a first dam and a second dam. The passive element is disposed between the first dam and the second dam. The passive element includes a first electrode portion electrically connected to the first passive element pad. A second electrode portion is electrically connected to the second passive element pad.

公开(公告)号：US10361177B2

公开(公告)日：2019-07-23

申请号：US15960698

申请日：2018-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Young Kim ,  Pyoungwan Kim ,  Hyunki Kim ,  Junwoo Park ,  Sangsoo Kim ,  Seung Hwan Kim ,  Sung-Kyu Park ,  Insup Shin

IPC: H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L25/11

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package comprises a lower semiconductor chip on a lower substrate, a lower molding layer covering the lower semiconductor chip on the lower substrate and including a molding cavity that extends toward the lower semiconductor chip from a top surface of the lower molding layer, an interposer substrate on the top surface of the lower molding layer and including a substrate opening that penetrates the interposer substrate and overlaps the molding cavity, and an upper package on the interposer substrate. The molding cavity has a floor surface spaced apart from the upper package across a substantially hollow space.