公开(公告)号：US10825778B2

公开(公告)日：2020-11-03

申请号：US16371653

申请日：2019-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hawn Bae ,  Pyung Hwa Han ,  Jung Soo Kim

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/495 ,  H01L23/538 ,  H01L23/31 ,  H01L23/522

Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer.

公开(公告)号：US10515916B2

公开(公告)日：2019-12-24

申请号：US16025267

申请日：2018-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae Jung Byun ,  Byung Ho Kim ,  Pyung Hwa Han ,  Joo Young Choi ,  Ung Hui Shin

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/28 ,  H01L23/522

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip. The first interconnection member includes a first insulating layer in contact with the second interconnection member, a first redistribution layer disposed on a surface of the first insulating layer in contact with the second interconnection member and electrically connected to the connection pads, and a blocking layer disposed on the surface of the first insulating layer on which the first redistribution layer is disposed and surrounding the through-hole.

公开(公告)号：US11189567B2

公开(公告)日：2021-11-30

申请号：US16580240

申请日：2019-09-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Pyung Hwa Han ,  Jung Soo Kim ,  Won Choi ,  Sung Hawn Bae

IPC: H01L23/528 ,  H01L23/544 ,  H01L23/522 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin; a mark indicating identification information and carved in the encapsulant; and a passivation layer disposed on the encapsulant and including a transparent resin.

公开(公告)号：US11094660B2

公开(公告)日：2021-08-17

申请号：US16560311

申请日：2019-09-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Soo Kim ,  Pyung Hwa Han ,  Sung Hawn Bae ,  Jin Won Lee

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/16 ,  H01L23/13 ,  H01L21/683 ,  H01L21/56

Abstract: A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection structure and having a plurality of first and second openings exposing, respectively, first and second regions of the redistribution layer; and a plurality of underbump metal layers connected to the first region of the redistribution layer through the plurality of first openings, respectively.

公开(公告)号：US20200105679A1

公开(公告)日：2020-04-02

申请号：US16371653

申请日：2019-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hawn Bae ,  Pyung Hwa Han ,  Jung Soo Kim

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/495 ,  H01L23/538 ,  H01L23/522 ,  H01L23/31

Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer.