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公开(公告)号：US10665549B2
公开(公告)日：2020-05-26
申请号：US16268874
申请日：2019-02-06
发明人： Sung Hawn Bae , Jung Soo Kim , Won Choi , Sung Hoan Kim
IPC分类号： H01L23/52 , H01L23/31 , H01L23/538 , H01L23/00 , H01L23/522 , H01L25/18
摘要： A fan-out semiconductor package includes: a frame, including a wiring layer, and having a through-hole; a semiconductor chip disposed in the through-hole, and including a connection pad; an encapsulant covering at least a portion of each of the frame and an inactive surface of the semiconductor chip, and having a first opening exposing at least a portion of the wiring layer; an insulating layer disposed on the encapsulant, and having a second opening formed in the first opening to expose at least a portion of the wiring layer; a conductive pattern layer disposed on the insulating layer; a conductive via disposed in the second opening; and a connection structure disposed on the frame and an active surface of the semiconductor chip, and including one or more redistribution layers. The conductive pattern layer and the redistribution layer are electrically connected to the connection pad.
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公开(公告)号：US10825778B2
公开(公告)日：2020-11-03
申请号：US16371653
申请日：2019-04-01
发明人： Sung Hawn Bae , Pyung Hwa Han , Jung Soo Kim
IPC分类号： H01L23/544 , H01L23/00 , H01L23/495 , H01L23/538 , H01L23/31 , H01L23/522
摘要： A semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer.
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公开(公告)号：US20200051918A1
公开(公告)日：2020-02-13
申请号：US16268874
申请日：2019-02-06
发明人： Sung Hawn Bae , Jung Soo Kim , Won Choi , Sung Hoan Kim
IPC分类号： H01L23/538 , H01L23/00 , H01L23/522 , H01L23/31 , H01L25/18
摘要： A fan-out semiconductor package includes: a frame, including a wiring layer, and having a through-hole; a semiconductor chip disposed in the through-hole, and including a connection pad; an encapsulant covering at least a portion of each of the frame and an inactive surface of the semiconductor chip, and having a first opening exposing at least a portion of the wiring layer; an insulating layer disposed on the encapsulant, and having a second opening formed in the first opening to expose at least a portion of the wiring layer; a conductive pattern layer disposed on the insulating layer; a conductive via disposed in the second opening; and a connection structure disposed on the frame and an active surface of the semiconductor chip, and including one or more redistribution layers. The conductive pattern layer and the redistribution layer are electrically connected to the connection pad.
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公开(公告)号：US11189567B2
公开(公告)日：2021-11-30
申请号：US16580240
申请日：2019-09-24
发明人： Pyung Hwa Han , Jung Soo Kim , Won Choi , Sung Hawn Bae
IPC分类号： H01L23/528 , H01L23/544 , H01L23/522 , H01L23/31 , H01L23/00
摘要： A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin; a mark indicating identification information and carved in the encapsulant; and a passivation layer disposed on the encapsulant and including a transparent resin.
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公开(公告)号：US11094660B2
公开(公告)日：2021-08-17
申请号：US16560311
申请日：2019-09-04
发明人： Jung Soo Kim , Pyung Hwa Han , Sung Hawn Bae , Jin Won Lee
IPC分类号： H01L21/48 , H01L23/00 , H01L23/31 , H01L23/498 , H01L25/16 , H01L23/13 , H01L21/683 , H01L21/56
摘要： A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection structure and having a plurality of first and second openings exposing, respectively, first and second regions of the redistribution layer; and a plurality of underbump metal layers connected to the first region of the redistribution layer through the plurality of first openings, respectively.
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公开(公告)号：US20200105679A1
公开(公告)日：2020-04-02
申请号：US16371653
申请日：2019-04-01
发明人： Sung Hawn Bae , Pyung Hwa Han , Jung Soo Kim
IPC分类号： H01L23/544 , H01L23/00 , H01L23/495 , H01L23/538 , H01L23/522 , H01L23/31
摘要： A semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer.
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