公开(公告)号：US09785186B2

公开(公告)日：2017-10-10

申请号：US14055549

申请日：2013-10-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Justin L. Gregg ,  Michael Rosenblatt ,  Alejandro Enrique Vallejo ,  Roberto M. Aimi ,  Jeff Beene ,  Ji-Yeon Lee

IPC: G06F1/16 ,  H04M1/02

CPC classification number: G06F1/1601 ,  Y10T29/49002

Abstract: A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.

公开(公告)号：US20140118908A1

公开(公告)日：2014-05-01

申请号：US14055549

申请日：2013-10-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Justin L. Gregg ,  Michael Rosenblatt ,  Alejandro Enrique Vallejo ,  Roberto M. Aimi ,  Jeff Beene ,  Ji-Yeon Lee

IPC: H05K7/02

CPC classification number: G06F1/1601 ,  Y10T29/49002

Abstract: A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.

Abstract translation: 包装系统包括：外部结构; 附着于外结构的陶瓷板; 以及容纳在外部结构中的内部装置部件。