公开(公告)号：US20230168517A1

公开(公告)日：2023-06-01

申请号：US17538886

申请日：2021-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sameer Bhalla ,  Chandni Kabra ,  Ji-Yeon Lee

IPC: G02B27/01

CPC classification number: G02B27/0176 ,  G02B27/0172 ,  G02B2027/0178 ,  G02B2027/0138

Abstract: An augmented reality (AR) device includes a frame and multiple front facing cameras connected with the frame. A first electrochromic material is connected with the frame, removably connected to a power source, and disposed over the multiple front facing cameras. AR display circuitry is connected to the frame and the power source. A mode state of the AR device is modified based on a detected do-not-record permission.

公开(公告)号：USD846589S1

公开(公告)日：2019-04-23

申请号：US29628733

申请日：2017-12-07

Applicant: Samsung Electronics Co., Ltd.

Designer： Eun-Nim Cho ,  Ji-Yeon Lee ,  Sang-Jin Han

公开(公告)号：US09785186B2

公开(公告)日：2017-10-10

申请号：US14055549

申请日：2013-10-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Justin L. Gregg ,  Michael Rosenblatt ,  Alejandro Enrique Vallejo ,  Roberto M. Aimi ,  Jeff Beene ,  Ji-Yeon Lee

IPC: G06F1/16 ,  H04M1/02

CPC classification number: G06F1/1601 ,  Y10T29/49002

Abstract: A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.

公开(公告)号：US11726339B2

公开(公告)日：2023-08-15

申请号：US17538886

申请日：2021-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sameer Bhalla ,  Chandni Kabra ,  Ji-Yeon Lee

IPC: G02B27/01

CPC classification number: G02B27/0176 ,  G02B27/0172 ,  G02B2027/0138 ,  G02B2027/0178

Abstract: An augmented reality (AR) device includes a frame and multiple front facing cameras connected with the frame. A first electrochromic material is connected with the frame, removably connected to a power source, and disposed over the multiple front facing cameras. AR display circuitry is connected to the frame and the power source. A mode state of the AR device is modified based on a detected do-not-record permission.

公开(公告)号：USD775595S1

公开(公告)日：2017-01-03

申请号：US29522263

申请日：2015-03-30

Applicant: Samsung Electronics Co., Ltd.

Designer： Howard Nuk ,  Jin-Seok Hwang ,  Alex Millie ,  Seoung-Hyun Son ,  Jeff Jones ,  Jeremy David Baker ,  James Lee ,  Ji-Yeon Lee

公开(公告)号：US20140118908A1

公开(公告)日：2014-05-01

申请号：US14055549

申请日：2013-10-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Justin L. Gregg ,  Michael Rosenblatt ,  Alejandro Enrique Vallejo ,  Roberto M. Aimi ,  Jeff Beene ,  Ji-Yeon Lee

IPC: H05K7/02

CPC classification number: G06F1/1601 ,  Y10T29/49002

Abstract: A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.

Abstract translation: 包装系统包括：外部结构; 附着于外结构的陶瓷板; 以及容纳在外部结构中的内部装置部件。